100th : Wafer production and chip packaging
First wafers will be completed on 2013-05-25 (few days delay). We have succeeded to request expedited packaging of first chips from the first wafers. We expect receiving packaged chips after 2013-05-30. These will be used to verify the function of the chips and test provisional board design. We believe board assembly with all 100th mine chips before 2013-07-01 is feasible.
Created on 2013-05-22 16:30:00 by Leszek Rychlewski; Published on 2013-05-22 16:35:16 by koji;