100th : Chip production started
Initial tapeout submitted. We will still modify the top metal layers while the production of the masks for the lower layers continues. We need to do final optimization of few logic elements that are currently left as unconnected NAND2 cells.
Tomorrow production of the firs mask will start (JDV, job deck view phase). We expect the production of the wafers to finish before end of May. 
Created on 2013-03-28 11:56:00 by Leszek Rychlewski; Published on 2013-03-28 12:02:39 by koji;